Test Socket
Test Socket은 반도체 후공정에서 패키징 이후 Final Test를 통해 반도체 IC의 양품 및 불량을 검사하기 위한 부품으로, 극한 테스트 환경에서도 정상적으로 역할을 수행할 수 있도록 최적의 소재 사용 및 제품 제작 역량이 필요합니다. 당사는 고객의 사용 환경에 적합한 소켓을 디자인/제작이 가능하며, 철저한 품질 관리를 통한 고품질의 서비스를 제공합니다.
WAFER LEVEL TEST
Developed with innovative and powerful WLCSP test technology, this product guarantees high test yields for the key parts of ever-evolving smart devices. This is also a reliable solution for the development environment to generate demand for more detailed and precise processes.
Experience the top-quality wafer level test solution.
주요사항
- Low contact resistance
- Design to secure strength based on structural analysis
- Materials with high durability for temperature and humidity change
- Quality improvement through precision processing
- Convenient maintenance
- Ceramic materials applied
- Excellent signal integrity
UNIVERSAL TEST
Typе Characteristics
- Application of solutions developed on the basis of extensive data
- Application of premium materials to minimize deformation
- Quality stability ensured through detailed measurements and precision processing
- Precise location decision simulation
- Device floating guide and device guide solution provided
- Structural analysis simulation
- Sn transition delay solution through special coating